International collaboration EU and Japan on semiconductors
Digital Europe · Grant topic
Summary
A Polish company can use this call for R&D.
Funds EU–Japan collaboration demonstrating semiconductor packaging, photonics and chiplet interoperability in laboratory and pilot manufacturing environments; applicant types are unspecified.
- Who can apply
- Unclear from the source.
- Amount
- €3M – €5M per projectTotal budget €5,000,000
- Deadline
- 08 Dec 2026 01:00 CETin 45 days
- Status
- Openopened 7 Jul 2026
Machine-classified from the call text; check eligibility at the source.
Description
Expected Outcome:
Projects are expected to contribute to the following expected outcomes:
• Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
• Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry.
Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
Who can apply, in detail
- Purpose
- Research and innovation
- R&D relevance
- 3 of 3
- Poland eligible
- Yes
- Country limit
- EU–Japan collaboration; involvement of Japanese counterparts is required.
- Region
- Any
- Consortium
- Unclear
- Readiness level (TRL)
- 5-7
- Topics
- Semiconductor chiplets
- Heterogeneous integration
- 2.5D and 3D packaging
- Integrated photonics
- AI hardware
Machine-classified from the call text; check eligibility at the source. 23 Oct 2026
Conditions
Typed facts extracted from the source documents by Scindu's grant-data review. Each value keeps its own conditions. Unknown means unstated, not zero or unlimited.
- Applications closed
- No
- Consortium required
- Yes
At least three independent legal entities must participate as beneficiaries; affiliated entities do not count toward this minimum.
- Eligible project scope
- The topic supports an EU–Japan chiplet ecosystem for heterogeneous integration in the AI stack, including 2.5D/3D packaging, integrated photonics and chiplet co-optimization; work should demonstrate across laboratory/pilot settings with semiconductor manufacturing use cases, with expected centre of gravity at TRL 5–7.
- Other condition
- The official Part B template asks applicants to list staff included in the project budget (budget category A) by function/profile and briefly describe their tasks. This is an application-planning prompt, not a call-specific headcount or hiring entitlement.
- Other condition
- The current official Chips JU call page and Appendix 8 show a deadline of 8 December 2026 at 17:00 Brussels time. The retained Guide for Applicants still states 24 September 2026 at 17:00, which conflicts with the newer current call page and Appendix 8; use the current 8 December date provisionally and confirm against the live submission system before filing.
- Other condition
- Topic scope names materials scientists, chemical engineers and AI experts among the expertise to engage; it also mentions semiconductor manufacturers as an organisational stakeholder. These scope references do not establish required employee hires.
- Partner requirement
- Proposers are expected to work closely with Japanese organisations and must describe how they involve Japanese counterparts and the activities on which they collaborate. A comparable commitment is expected from Japanese organisations.
Amounts and costs
- Indicative budget
- €5,000,000
Topic budget as stated in the portal's budget table. Lump-sum and per-project limits are in the call conditions.
- Call allocation
- €5,000,000
Indicative EU-side call budget; not an individual project award or entitlement.
- Funding intensity, maximum
- 50
Maximum EU reimbursement share of eligible costs for for-profit organisations; beneficiaries may ask for a lower contribution.
- Funding intensity, maximum
- 50
Maximum EU reimbursement share of eligible costs for University/Other not-for-profit entities; beneficiaries may ask for a lower contribution.
- Funding intensity, maximum
- 50
Maximum EU reimbursement share of eligible costs for for-profit SMEs; beneficiaries may ask for a lower contribution.
- Expected project funding, up to
- €5,000,000
Expected contribution range only; different amounts may be submitted and selected, so not an individual entitlement or hard cap.
- Expected project funding, from
- €3,000,000
Expected contribution range only; different amounts may be submitted and selected, so not an individual entitlement or hard cap.
Personnel and services
Technical staff
Example only
The topic scope identifies this expertise to be engaged, but does not require an employment relationship or a specific role in the consortium. This illustrative profile does not assert a hire, headcount, qualification threshold, FTE, duration, rate or salary.
Source documents
Call facts
- Opens
- 7 Jul 2026
- Deadline model
- Single-stage
- Programme
- Digital Europe · 2021 - 2027
- Call
- DIGITAL-JU-CHIPS-2026-SG-JAPAN · DIGITAL-JU-CHIPS-2026-SG-JAPAN
- Types of action
- DIGITAL JU Simple Grants
- Source
- ec.europa.eu
- Checked
- 24 Oct 2026
- Portal updated
- 23 Sept 2026
- Review status
- Partial review
- Reviewed
- 23 Oct 2026
This is a summary of the source page, not the official text. Eligibility, conditions and the submission system are at the source.