Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)
Horizon Europe · Grant topic
Summary
A Polish company can use this call for R&D.
Funds research into integrated photonic devices and circuits delivering improved functionality, performance and energy efficiency across industrial, digital, health and security applications.
- Who can apply
- Companies can lead: SME, large company, startup, research org, university.
- Amount
- €25,000,000Indicative budget
- Deadline
- 18 Mar 2027 01:00 CETin 145 days
- Status
- Forthcomingopens 17 Nov 2026
Machine-classified from the call text; check eligibility at the source.
Description
Expected Outcome:
• Advanced integrated photonic devices and circuits with enhanced functionality and performance enabling wider application across multiple sectors including digital, automotive, industrial, health and security
• Reinforced competitiveness of EU photonics actors by demonstrating advancements in representative system configurations and validating real-world applicability
• Significantly improved performance of electro-optic systems in applications such as communication, computing, sensing, medical diagnostics, data processing, AI supporting the introduction of photonic elements into such systems
• Low power consumption sensors with increased performance in application domains
Scope:
R&I should enhance the functionality, efficiency, and integration of photonic devices and circuits with a focus extended system performance. Action should address at least two of the following aspects.
• Enhanced performance through improved spectral purity, wavelength coverage, output power and noise characteristics.
• Increased modulation or detection speeds going beyond the capability of existing PIC material platforms, improved signal-processing capabilities, and integration of novel materials such as thin-film LiNbO3, BTO, graphene, silicon carbide, phase change materials and TMDCs.
• Miniaturised, high-complexity photonic circuits (e.g. multilayer photonics, chiplets, multiple integrated functional elements), scalable interconnects and electronics-photonics integration (co-packaged, heterogeneous, or monolithic) to improve performance, reliability, and cost-efficiency.
• Reduction of power consumption for example through improved electrical-to-optical conversion, lower optical losses, devices operable at higher temperatures to reduce cooling needs, and low-power circuit actuation and control.
Proposals should consider system-level impact and demonstrate advancements in representative configurations relevant to one or more application domains.
This topic implements the co-programmed European Partnership on photonics.
null
Activities are expected to start at TRL 3 and achieve TRL 6 by the end of the project – see General Annex B.
Who can apply, in detail
- Applicant types
- SME, Large company, Startup, Research org, University
- Purpose
- Research and innovation
- R&D relevance
- 3 of 3
- Poland eligible
- Yes
- Country limit
- —
- Region
- Any
- Consortium
- Required
- Readiness level (TRL)
- —
- Topics
- Integrated photonics
- Photonic circuits
- Ultra-low-power sensors
- Optical computing
- Electro-optic systems
Machine-classified from the call text; check eligibility at the source. 23 Oct 2026
Amounts and costs
- Indicative budget
- €25,000,000
Topic budget as stated in the portal's budget table. Lump-sum and per-project limits are in the call conditions.
Call facts
- Opens
- 17 Nov 2026
- Deadline model
- Single-stage
- Programme
- Horizon Europe · 2021 - 2027
- Call
- HORIZON-CL4-2027-05 · DIGITAL
- Types of action
- HORIZON Research and Innovation Actions
- Keywords
- chips
- integrated circuits
- low power consumption
- photonics
- Source
- ec.europa.eu
- Checked
- 24 Oct 2026
- Portal updated
- 2 Mar 2026
This is a summary of the source page, not the official text. Eligibility, conditions and the submission system are at the source.